The thermal pad is silicone based with modelling clay like consistency. This allows a perfect surface shaping with maximum possible compression. The minus pad extreme is electrically insulating.
Due to the consistency only one-time use is recommended. The thermal conductivity was improved by about 260 % over the minus pad 8 which allows best cooling for tough cooling operations such as voltage regulators and memory ICs.
- Most excellent thermal conductivity
- No bleeding
- long-term stability
- high compression rate
| Application | Rating |
| Thermal Conductivity | ***** |
| Sub-Zero Overclocking | * |
| Overclocking | **** |
| Water Cooling | ***** |
| Air Cooling | ***** |
| Silicone Sensitive Areas | — |
within the capabilities of thermal pads
The minus pad extreme is available in size 120 x 20 mm and 100 x 100 mm with thicknesses of 0,5mm, 1mm, 1,5mm, 2mm, 3mm.
Hardness Shore 00 – 65
Thickness0,5–3,0 mm
Typical thickness tolerance± 0,1 mm
Flammability V-0
Electically insulatingJa (8 KV/mm ASTM D149)
Density 3.38 g/cm³
Temperature Range -100 °C / +200 °C
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